• Start of the project : 01-09-19
  • End of project : 28-02-22


The PONAMP project focuses on the development of new materials for additive techniques based on powder bed fusion, resulting in parts with improved properties. Indeed, a limited number of metal alloys are currently qualified for additive manufacturing. However, industrial demands are increasingly directed towards materials with superior properties, for larger and higher value applications. The approach in this project is to combine an existing alloy in powder form with another material added as a thin surface coating, which will mix during the additive process to counter the problems encountered with traditional alloys. Two strands will be investigated: aluminium alloys for high mechanical resistance, and copper and copper alloys for their electrical properties. The manufacture of demonstrators in each of the two materials is planned at the end of the project.

These solutions will be tested in terms of mechanical, physical and economic viability in order to broaden the range.

of copper- and aluminium-based materials available in the various AM techniques and to guarantee the durability of the proposed technological solutions. In this context, the Walloon partners will optimise the process at several levels.

Objectives and missions of Materia Nova

Within the consortium, Materia Nova will carry out surface treatments by hot cathode magnetron sputtering on the targeted powders (Al and Cu base). The development of homogeneous or partial encapsulation with different materials will allow the optimization of the powders and make the targeted alloys usable on AM fusion techniques.

The consortium

Forschungsinstitut edelmetalle + metallchemie (FEM), Fraunhofer UMSICHT, Materia Nova, Sirris and UMons.

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